| thickness (μm) | article number |
| 500 | DSP-150×0500-AFG-00 |
General properties
- material: SCG32
- thickness tolerance: ± 10 μm
- edge exclusion: 6 mm
- polishing: double side polished
- surface roughness (Ra): < 1 nm
- ttv: < 10 μm
- scratch-dig: 60-40
- cte: 3.17 ppm/K
- packaging: cleanroom packed
- packing units: 10 pcs, 25 pcs
- material data sheet
150 mm WAFERS
- diameter: 150.0 ± 0.3 mm
- bow: < 60 μm
- SEMI flat /notch: 57.5 mm
200 mm WAFERS
- diameter: 200.0 ± 0.3 mm
- bow: < 80 μm
- SEMI flat /notch: Notch
| thickness (μm) | article number |
| 725 | DSP-200×0725-AFG-00 |
Additional products
BOROSILICATE WAFERS
BOROSILICATE WAFERSMDF POLISHING GRADE
QUARTZ WAFERSSEMICONDUCTOR GRADE
CARRIER WAFER FOR LASER / MECHANICAL RELEASE
BLACK QUARTZ CARRIER
SI-ADAPTER CARRIER
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