Carriers are used for thin wafer handling by supporting the device wafer with a rigid carrier during processing. Wafer Universe carriers are reusable for many temporary bonds.
Those carriers made of Borofloat33® glass and SCG72 are perfectly adapted to Silicon and GaAs device wafers due to their similar coefficient of thermal expansion (cte).
CARRIER FOR SI-WAFER
151 mm CARRIER
- material: Borofloat33® glass
- diameter: 151.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 60 μm
- flat: SEMI (57.5 mm)
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
201 mm CARRIER
- material: Borofloat33® glass
- diameter: 201.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 80 μm
- no notch
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
301 mm CARRIER
- material: Borofloat33® glass
- diameter: 301.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 200 μm
- no notch
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
CARRIER FOR GaAs
152 mm CARRIER
- material: SCG72
- diameter: 152.0 ± 0.2 mm
- cte: 7.2 ppm/K (adapted to GaAs)
- thickness: 650 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 60 μm
- no flat
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
Additional products
BOROFLOAT33® GLASS WAFERS
REGULAR POLISHING GRADE
BOROFLOAT33® GLASS WAFERS
WITH MDF POLISHING GRADE
ALKALINE FREE GLASS WAFERS
QUARTZ WAFERS
SEMICONDUCTOR GRADE
QUARTZ WAFER
HP FUSED SILICA WAFER
BLACK QUARTZ CARRIER
SI-ADAPTER CARRIER
GLASS-ADAPTER CARRIER
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