| hole diameter / pitch | article number | shop |
| 300 ± 100µm / 500µm | CCR-150×640-B33-01 |  |
| 500 ± 100µm / 1000µm | CCR-150×640-B33-02 | |
Carrier wafer for chemical release are ideally suited for a chemical release process where a solvent gets in contact with the adhesive and releases it. For this type of debonding, thousands of holes through the Carrier Wafer enable consistent contact and fast decomposition of the adhesive.
150 mm
- material: Borofloat33® glass
- cte: 3.25 ppm/K (adapted to Si)
- diameter:150.2 ± 0.3 mm
- thickness: 640 ± 5 µm
- ttv: < 3 µm
- flat: according to SEMI (57.5 mm)
- edge: according to SEMI M1
- surface: perforated
- area, filled with holes: D 148 mm
- marking: lot & serial number
- packing: clean room packed under ISO 6 conditions according to ISO 14644
- material data sheet
200 mm
- material: Borofloat33® glass
- cte: 3.25 ppm/K (adapted to Si)
- diameter: 200.2 ± 0.3 mm
- thickness: 640 ± 5 µm
- notch: according to SEMI
- edge: according to SEMI M1
- surface: perforated
- area, filled with holes: D 198 mm
- marking: lot & serial number
- packaging: clean room packed under ISO 6 conditions according to ISO 14644
- material data sheet
| hole diameter / pitch | article number | shop |
| 300 ± 100µm / 500µm | CCR-200×640-B33-01 | |
| 500 ± 100µm / 1000µm | CCR-200×640-B33-02 | |
Additional products
BOROFLOAT33® GLASS WAFERS
REGULAR POLISHING GRADE
BOROFLOAT33® GLASS WAFERS
WITH MDF POLISHING GRADE
ALKALINE FREE GLASS WAFERS
QUARTZ WAFERS
SEMICONDUCTOR GRADE
QUARTZ WAFER
HP FUSED SILICA WAFER
CARRIER WAFER
FOR LASER / MECHANICAL RELEASE
SI-ADAPTER CARRIER
GLASS-ADAPTER CARRIER
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