| pocket diameter* | article number | shop |
| 102.0 ± 0.5 mm | CAD-150×0900-AFG-40 |  |
Adapter carriers enable the processing of wafers with various diameters on the same tool. The carrier diameter fits your processing equipment and allows processing of different wafer diameters without needing an expensive equipment change or tool implementation. Due to non-conductive material properties whilst avoiding alkaline ions, these carriers are suitable for tasks which do not allow conductive materials.
150 mm WAFERS
- material: Alkaline free Glass
- diameter: 150.0 ± 0.3 mm
- thickness: 900 ± 10 µm
- polishing: double side frosted
- flat: SEMI (57.5 mm)
with centered pockets:
- pocket depth: 500 ± 50 µm
- pocket walls: rounded (approx. 500 µm radius)
- pocket bottom: frosted
- flat: no flat in pocket
- packing units: 3 pcs
200 mm WAFERS
- material: Alkaline free Glass
- diameter: 200.00 ± 0.3 mm
- thickness: 900 ± 10 µm
- polishing: double side frosted
- notch: SEMI
with centered pockets:
- pocket depth: 500 ± 50 µm
- pocket walls: rounded (approx. 500 µm radius)
- pocket bottom: frosted
- flat: no flat in pocket
- packing units: 3 pcs
| pocket diameter* | article number | shop |
| 102.0 ± 0.5 mm | CAD-200×0900-AFG-40 | |
| 152.0 ± 0.5 mm | CAD-200×0900-AFG-60 | |
300 mm WAFERS
- material: Alkaline free Glass
- diameter: 300.00 ± 0.3 mm
- thickness: 900 ± 10 µm
- polishing: double side frosted
- notch: SEMI
with centered pockets:
- pocket depth: 500 ± 50 µm
- pocket walls: rounded (approx. 500 µm radius)
- pocket bottom: frosted
- flat: no flat in pocket
- packing units: 3 pcs
| pocket diameter* | article number | shop |
| 152.0 ± 0.5 mm | CAD-300×0900-AFG-60 | |
| 202.0 ± 0.5 mm | CAD-300×0900-AFG-80 | |
*at carrier surface
Additional products
BOROFLOAT33® GLASS WAFERS
REGULAR POLISHING GRADE
BOROFLOAT33® GLASS WAFERS
MDF POLISHING GRADE
ALKALINE-FREE GLASS WAFERS
QUARTZ WAFERS
SEMICONDUCTOR GRADE
QUARTZ WAFER
HP FUSED SILICA
CARRIER WAFER
FOR LASER/MECHANICAL RELEASE
BLACK QUARTZ WAFERS
SI-ADAPTER WAFERS
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