Adapter Carrier enables the processing of wafers with various diameters on the same tool. The carrier diameter fits to your processing equipment and allows processing of different wafer diameter without need of expensive equipment change or tool implementation.

General properties

  • material: Si
  • pocket bottom: frosted
  • no flat in pocket
  • packing units: 3 pcs

150 mm WAFERS

  • diameter: 150.0 ± 0.3 mm
  • thickness: 625 ± 25 µm
  • front side: polished
  • back side: etched
  • SEMI flat /notch: 57.5 mm

with centered pockets:

  • pocket depth: 300 ±50 µm
  • pocket walls: rounded (approx. 300 µm radius)
pocket diameter* article number
102.0 ± 0.5 mm CAD-150×0625-SIL-40

200 mm WAFERS

  • diameter: 200 ± 0.3 mm
  • thickness: 725 ± 25 µm
  • front side: polished
  • back side: etched
  • SEMI flat /notch: notch

with centered pockets:

  • pocket depth: 350 ±50 µm
  • pocket walls: rounded (approx. 350 µm radius)
pocket diameter* article number
102.0 ± 0.5 mm CAD-200×0725-SIL-40
152.0 ± 0.5 mm CAD-200×0725-SIL-60

300 mm WAFERS

  • diameter: 300 ± 0.3 mm
  • thickness: 725 ± 25 µm
  • front side: polished
  • back side: polished
  • SEMI flat /notch: notch

with centered pockets:

  • pocket depth: 300 ±50 µm
  • pocket walls: rounded (approx. 300 µm radius)
pocket diameter* article number
152.0 ± 0.5 mm CAD-300×0775-SIL-60
202.0 ± 0.5 mm CAD-300×0775-SIL-80

*at carrier surface

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Additional products

Do you need customization?

Customized designs are available through Plan Optik AG.