Adapter Carrier enables the processing of wafers with various diameters on the same tool. The carrier diameter fits to your processing equipment and allows processing of different wafer diameter without need of expensive equipment change or tool implementation.

150 mm WAFERS

  • material: Si
  • diameter: 150.0 ± 0.3 mm
  • thickness: 625 ± 25 µm
  • front side: polished
  • back side: etched
  • flat: SEMI (57.5 mm)
  • packing units: 3 pcs

with centered pockets:

  • pocket depth: 300 ±50 µm
  • pocket walls: rounded (approx. 300 µm radius)
  • pocket bottom: frosted
  • no flat in pocket
pocket diameter* article number shop
102.0 ± 0.5 mm CAD-150×0625-SIL-40

200 mm WAFERS

  • material: Si
  • diameter: 200 ± 0.3 mm
  • thickness: 725 ± 25 µm
  • front side: polished
  • back side: etched
  • notch: SEMI
  • packing units: 3 pcs

with centered pockets:

  • pocket depth: 350 ±50 µm
  • pocket walls: rounded (approx. 350 µm radius)
  • pocket bottom: frosted
  • no flat in pocket
pocket diameter* article number shop
102.0 ± 0.5 mm CAD-200×0725-SIL-40
152.0 ± 0.5 mm CAD-200×0725-SIL-60

300 mm WAFERS

  • material: Si
  • diameter: 300 ± 0.3 mm
  • thickness: 725 ± 25 µm
  • front side: polished
  • back side: etched
  • notch: SEMI
  • packing units: 3 pcs

with centered pockets:

  • pocket depth: 300 ±50 µm
  • pocket walls: rounded (approx. 350 µm radius)
  • pocket bottom: frosted
  • no flat in pocket
pocket diameter* article number shop
152.0 ± 0.5 mm CAD-300×0775-SIL-60
202.0 ± 0.5 mm CAD-300×0775-SIL-80

*at carrier surface

Additional products

BOROSILICATE WAFERS

REGULAR POLISHING GRADE

BOROSILICATE WAFERS

MDF POLISHING GRADE

ALKALINE-FREE GLASS WAFERS

QUARTZ WAFERS

SEMICONDUCTOR GRADE

QUARTZ WAFER

HP FUSED SILICA

CARRIER WAFER

FOR LASER/MECHANICAL RELEASE

BLACK QUARTZ WAFERS

GLASS-ADAPTER WAFERS

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