| pocket diameter* | article number | shop |
| 102.0 ± 0.5 mm | CAD-150×0625-SIL-40 |  |
Adapter Carrier enables the processing of wafers with various diameters on the same tool. The carrier diameter fits to your processing equipment and allows processing of different wafer diameter without need of expensive equipment change or tool implementation.
150 mm WAFERS
- material: Si
- diameter: 150.0 ± 0.3 mm
- thickness: 625 ± 25 µm
- front side: polished
- back side: etched
- flat: SEMI (57.5 mm)
- packing units: 3 pcs
with centered pockets:
- pocket depth: 300 ±50 µm
- pocket walls: rounded (approx. 300 µm radius)
- pocket bottom: frosted
- no flat in pocket
200 mm WAFERS
- material: Si
- diameter: 200 ± 0.3 mm
- thickness: 725 ± 25 µm
- front side: polished
- back side: etched
- notch: SEMI
- packing units: 3 pcs
with centered pockets:
- pocket depth: 350 ±50 µm
- pocket walls: rounded (approx. 350 µm radius)
- pocket bottom: frosted
- no flat in pocket
| pocket diameter* | article number | shop |
| 102.0 ± 0.5 mm | CAD-200×0725-SIL-40 | |
| 152.0 ± 0.5 mm | CAD-200×0725-SIL-60 | |
300 mm WAFERS
- material: Si
- diameter: 300 ± 0.3 mm
- thickness: 725 ± 25 µm
- front side: polished
- back side: etched
- notch: SEMI
- packing units: 3 pcs
with centered pockets:
- pocket depth: 300 ±50 µm
- pocket walls: rounded (approx. 350 µm radius)
- pocket bottom: frosted
- no flat in pocket
| pocket diameter* | article number | shop |
| 152.0 ± 0.5 mm | CAD-300×0775-SIL-60 | |
| 202.0 ± 0.5 mm | CAD-300×0775-SIL-80 | |
*at carrier surface
Additional products
BOROFLOAT33® GLASS WAFERS
REGULAR POLISHING GRADE
BOROFLOAT33® GLASS WAFERS
MDF POLISHING GRADE
ALKALINE-FREE GLASS WAFERS
QUARTZ WAFERS
SEMICONDUCTOR GRADE
QUARTZ WAFER
HP FUSED SILICA
CARRIER WAFER
FOR LASER/MECHANICAL RELEASE
BLACK QUARTZ WAFERS
GLASS-ADAPTER WAFERS
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