Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics.

Wafer Universe stock products from borosilicate glass have a coefficient of thermal expansion (cte) that is adapted to silicon, which makes them the perfect substrate to use in anodic bonding. The glass features good transmission over a wide spectrum as well as high chemical resistance and mechanical strength. Furthermore, these wafers can be used in high temperature processing.

General properties

  • material: BOROFLOAT33®
  • cte: 3.25 ppm/K (adapted to Si)
  • thickness tolerance: ± 10 μm
  • polishing: double side polished

for MDF polished wafers click here

  • surface roughness (Ra): < 1 nm
  • ttv: < 10 μm
  • scratch-dig: 60-40
  • packaging: cleanroom packed
  • packing units: 10 pcs, 25 pcs
  • material data sheet

100 mm WAFERS

  • diameter: 100.0 ± 0.3 mm
  • bow: < 30 μm
  • SEMI flat /notch: 32.5 mm
  • edge exclusion: 6 mm

150 mm WAFERS

  • diameter: 150.0 ± 0.3 mm
  • bow: < 60 μm
  • SEMI flat /notch: 57.5 mm
  • edge exclusion: 6 mm

200 mm WAFERS

  • diameter: 200.0 ± 0.3 mm
  • bow: < 80 μm
  • SEMI flat /notch: Notch
  • edge exclusion: 4 mm

300 mm WAFERS

  • diameter: 300.0 ± 0.3 mm
  • bow: < 100 μm
  • SEMI flat /notch: Notch
  • edge exclusion: 4 mm

Additional products

BOROSILICATE WAFERS
MDF POLISHING GRADE

ALKALINE FREE
GLASS WAFERS

QUARTZ WAFERS
SEMICONDUCTOR GRADE

CARRIER WAFER FOR LASER / MECHANICAL RELEASE

BLACK QUARTZ CARRIER

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