BOROSILICATE WAFERS REGULAR POLISHING GRADE

Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics.

Wafer Universe stock products from borosilicate glass have a coefficient of thermal expansion (cte) that is adapted to silicon, which makes them the perfect substrate to use in anodic bonding. The glass features good transmission over a wide spectrum as well as high chemical resistance and mechanical strength. Furthermore, these wafers can be used in high temperature processing.

General properties

material: BOROFLOAT33^®
cte: 3.25 ppm/K (adapted to Si)
thickness tolerance: ± 10 μm
polishing: double side polished

for MDF polished wafers click here

surface roughness (Ra): < 1 nm

ttv: < 10 μm
scratch-dig: 60-40
packaging: cleanroom packed
packing units: 10 pcs, 25 pcs
material data sheet

100 mm WAFERS

diameter: 100.0 ± 0.3 mm
bow: < 30 μm
SEMI flat /notch: 32.5 mm
edge exclusion: 6 mm

thickness (μm)	article number
300	DSP-100×0300-B33-00
400	DSP-100×0400-B33-00
500	DSP-100×0500-B33-00
600	DSP-100×0600-B33-00
700	DSP-100×0700-B33-00
1000	DSP-100×1000-B33-00

150 mm WAFERS

diameter: 150.0 ± 0.3 mm
bow: < 60 μm
SEMI flat /notch: 57.5 mm
edge exclusion: 6 mm

thickness (μm)	article number
300	DSP-150×0300-B33-00
400	DSP-150×0400-B33-00
500	DSP-150×0500-B33-00
600	DSP-150×0600-B33-00
700	DSP-150×0700-B33-00
1000	DSP-150×1000-B33-00

200 mm WAFERS

diameter: 200.0 ± 0.3 mm
bow: < 80 μm
SEMI flat /notch: Notch
edge exclusion: 4 mm

thickness (μm)	article number
300	DSP-200×0300-B33-00
400	DSP-200×0400-B33-00
500	DSP-200×0500-B33-00
600	DSP-200×0600-B33-00
700	DSP-200×0700-B33-00
1000	DSP-200×1000-B33-00