Carriers are used for thin wafer handling by supporting the device wafer with a rigid carrier during processing. Wafer Universe carriers are reusable for many temporary bonds.

Those carriers made of borosilicate glass and SCG72 are perfectly adapted to Silicon and GaAs device wafers due to their similar coefficient of thermal expansion (cte).

CARRIER FOR SI-WAFER

General properties

  • material: BOROFLOAT33®
  • cte: 3.25 ppm/K (adapted to Si)
  • polishing: double side polished
  • edge exclusion: 5 mm
  • thickness: 705 ± (see product spec)
  • packaging: cleanroom packed
  • packing units: 10 pcs
  • material data sheet

151 mm CARRIER

  • diameter: 151.0 ± 0.1 mm
  • bow: < 60 μm
  • SEMI flat /notch: 57.5 mm
thickness tolerance (µm) ttv (µm) article number
± 3 < 1 CLM-151×0705-B33-01
± 5 < 3 CLM-151×0705-B33-02
± 10 < 5 CLM-151×0705-B33-03

201 mm CARRIER

  • diameter: 201.0 ± 0.1 mm
  • bow: < 80 μm
  • SEMI flat /notch: no notch
thickness tolerance (µm) ttv (µm) article number
± 3 < 1 CLM-201×0705-B33-01
± 5 < 3 CLM-201×0705-B33-02
± 10 < 5 CLM-201×0705-B33-03

301 mm CARRIER

  • diameter: 301.0 ± 0.1 mm
  • bow: < 200 μm
  • SEMI flat /notch: no notch
thickness tolerance (µm) ttv (µm) article number
± 5 < 3 CLM-301×0705-B33-02
± 10 < 5 CLM-301×0705-B33-03

CARRIER FOR GaAs

General properties

  • material: SCG72
  • cte: 7.2 ppm/K (adapted to GaAs)
  • polishing: single side polished
  • edge exclusion: 5 mm
  • thickness: 650 ± (see product spec)
  • packaging: cleanroom packed
  • packing units: 10 pcs
  • material data sheet

152 mm CARRIER

  • diameter: 152.0 ± 0.2 mm
  • bow: < 60 μm
  • SEMI flat /notch: no flat
thickness tolerance (µm) ttv (µm) article number
± 3 < 2 CGA-152×0650-S72-00

Additional products

BOROSILICATE WAFERS REGULAR POLISHING

BOROSILICATE WAFERS
MDF POLISHING GRADE

ALKALINE FREE
GLASS WAFERS

QUARTZ WAFERS
SEMICONDUCTOR GRADE

BLACK QUARTZ CARRIER

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