| thickness tolerance (µm) | ttv (µm) | article number |
| ± 3 | < 1 | CLM-151×0705-B33-01 |
| ± 5 | < 3 | CLM-151×0705-B33-02 |
| ± 10 | < 5 | CLM-151×0705-B33-03 |
Carriers are used for thin wafer handling by supporting the device wafer with a rigid carrier during processing. Wafer Universe carriers are reusable for many temporary bonds.
Those carriers made of borosilicate glass and SCG72 are perfectly adapted to Silicon and GaAs device wafers due to their similar coefficient of thermal expansion (cte).
CARRIER FOR SI-WAFER
General properties
- material: BOROFLOAT33®
- cte: 3.25 ppm/K (adapted to Si)
- polishing: double side polished
- edge exclusion: 5 mm
- thickness: 705 ± (see product spec)
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
151 mm CARRIER
- diameter: 151.0 ± 0.1 mm
- bow: < 60 μm
- SEMI flat /notch: 57.5 mm
201 mm CARRIER
- diameter: 201.0 ± 0.1 mm
- bow: < 80 μm
- SEMI flat /notch: no notch
| thickness tolerance (µm) | ttv (µm) | article number |
| ± 3 | < 1 | CLM-201×0705-B33-01 |
| ± 5 | < 3 | CLM-201×0705-B33-02 |
| ± 10 | < 5 | CLM-201×0705-B33-03 |
301 mm CARRIER
- diameter: 301.0 ± 0.1 mm
- bow: < 200 μm
- SEMI flat /notch: no notch
| thickness tolerance (µm) | ttv (µm) | article number |
| ± 5 | < 3 | CLM-301×0705-B33-02 |
| ± 10 | < 5 | CLM-301×0705-B33-03 |
CARRIER FOR GaAs
General properties
- material: SCG72
- cte: 7.2 ppm/K (adapted to GaAs)
- polishing: single side polished
- edge exclusion: 5 mm
- thickness: 650 ± (see product spec)
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
152 mm CARRIER
- diameter: 152.0 ± 0.2 mm
- bow: < 60 μm
- SEMI flat /notch: no flat
| thickness tolerance (µm) | ttv (µm) | article number |
| ± 3 | < 2 | CGA-152×0650-S72-00 |
Additional products
BOROSILICATE WAFERS REGULAR POLISHING
BOROSILICATE WAFERS
MDF POLISHING GRADE
ALKALINE FREE
GLASS WAFERS
QUARTZ WAFERS
SEMICONDUCTOR GRADE
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