Carriers are used for thin wafer handling by supporting the device wafer with a rigid carrier during processing. Wafer Universe carriers are reusable for many temporary bonds.
Those carriers made of borosilicate glass and SCG72 are perfectly adapted to Silicon and GaAs device wafers due to their similar coefficient of thermal expansion (cte).
CARRIER FOR SI-WAFER
151 mm CARRIER
- material: BOROFLOAT33®
- diameter: 151.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 60 μm
- flat: SEMI (57.5 mm)
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
201 mm CARRIER
- material: BOROFLOAT33®
- diameter: 201.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 80 μm
- no notch
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
301 mm CARRIER
- material: BOROFLOAT33®
- diameter: 301.0 ± 0.1 mm
- cte: 3.25 ppm/K (adapted to Si)
- thickness: 705 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 200 μm
- no notch
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
CARRIER FOR GaAs
152 mm CARRIER
- material: SCG72
- diameter: 152.0 ± 0.2 mm
- cte: 7.2 ppm/K (adapted to GaAs)
- thickness: 650 ± (see product spec)
- edge exclusion: 5 mm
- polishing: double side polished
- bow: < 60 μm
- no flat
- packaging: cleanroom packed
- packing units: 10 pcs
- material data sheet
Additional products
BOROSILICATE WAFER
REGULAR POLISHING GRADE
BOROSILICATE WAFER
MDF POLISHING GRADE
ALKALINE FREE GLASS WAFER
QUARTZ WAFER
SEMICONDUCTOR GRADE
QUARTZ WAFER
HP FUSED SILICA WAFER
BLACK QUARTZ CARRIER
SI-ADAPTER CARRIER
GLASS-ADAPTER CARRIER
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