MDF polished wafers are treated by an enhanced polishing process (Micro Damage Free). These wafers are specifically developed for chemical patterning processes (wet-etching) leading to higher yield due to reduced defect rate.

Their extremely low sub-nanometer surface roughness makes them ideally suited for direct bonding (fusion bonding).

General properties

  • material: BOROFLOAT33®
  • thickness tolerance: ± 10 μm
  • edge exclusion: 6 mm
  • polishing: double side MDF polished

for regular polished wafers click here

  • surface roughness (Ra): < 0.5 nm
  • ttv: < 10 μm
  • surface roughness: <0.5 nm (Ra)
  • cte: 3.25 ppm/K (adapted to Si)
  • sub-surface damaging reduction: >99%
  • packaging: cleanroom packed
  • packing units: 10 pcs, 25 pcs
  • material data sheet

100 mm WAFERS

  • diameter: 100.0 ± 0.3 mm
  • SEMI flat /notch: 32.5 mm
thickness (μm) article number
500 MDF-100×0500-B33-00

150 mm WAFERS

  • diameter: 150.0 ± 0.3 mm
  • SEMI flat /notch: 57.5 mm
thickness (μm) article number
500 MDF-150×0500-B33-00

200 mm WAFERS

  • diameter: 200.0 ± 0.3 mm
  • SEMI flat /notch: Notch
thickness (μm) article number
500 MDF-200×0500-B33-00

Additional products

BOROSILICATE WAFERS
REGULAR POLISHING GRADE

ALKALINE FREE
GLASS WAFERS

QUARTZ WAFERS
SEMICONDUCTOR GRADE

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