Adapter carriers enable the processing of wafers with various diameters on the same tool. The carrier diameter fits your processing equipment and allows processing of different wafer diameters without needing an expensive equipment change or tool implementation. Due to non-conductive material properties whilst avoiding alkaline ions, these carriers are suitable for tasks which do not allow conductive materials.

150 mm WAFERS

  • material: Alkaline free Glass
  • diameter: 150.0 ± 0.3 mm
  • thickness: 900 ± 10 µm
  • polishing: double side frosted
  • flat: SEMI (57.5 mm)

with centered pockets:

  • pocket depth: 500 ± 50 µm
  • pocket walls: rounded (approx. 500 µm radius)
  • pocket bottom: frosted
  • flat: no flat in pocket
  • packing units: 3 pcs
pocket diameter* article number shop
102.0 ± 0.5 mm CAD-150×0900-AFG-40

200 mm WAFERS

  • material: Alkaline free Glass
  • diameter: 200.00 ± 0.3 mm
  • thickness: 900 ± 10 µm
  • polishing: double side frosted
  • notch: SEMI

with centered pockets:

  • pocket depth: 500 ± 50 µm
  • pocket walls: rounded (approx. 500 µm radius)
  • pocket bottom: frosted
  • flat: no flat in pocket
  • packing units: 3 pcs
pocket diameter* article number shop
102.0 ± 0.5 mm CAD-200×0900-AFG-40
152.0 ± 0.5 mm CAD-200×0900-AFG-60

300 mm WAFERS

  • material: Alkaline free Glass
  • diameter: 300.00 ± 0.3 mm
  • thickness: 900 ± 10 µm
  • polishing: double side frosted
  • notch: SEMI

with centered pockets:

  • pocket depth: 500 ± 50 µm
  • pocket walls: rounded (approx. 500 µm radius)
  • pocket bottom: frosted
  • flat: no flat in pocket
  • packing units: 3 pcs
pocket diameter* article number shop
152.0 ± 0.5 mm CAD-300×0900-AFG-60
202.0 ± 0.5 mm CAD-300×0900-AFG-80

*at carrier surface

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