150 mm high purity fused silica wafer

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Delivery time: 3-5 days for products in stock

Categories: , SKU: DSP-150x0675-FSQ-00

Additional information

material

high purity fused silica

cte

0.57 ppm/K

diameter

150 mm

diameter tolerance

± 0.3 mm

thickness

675 µm

thickness tolerance

± 10 µm

polishing

double side polished

roughness

< 0.5 nm (Ra)

ttv

< 10 µm

bow

< 60 µm

flat

according to SEMI (57.5 mm)

surface

scratch-dig 20-10 according MIL-PRF-13830

edge exclusion

6 mm

packing

clean room packed under ISO 6 conditions according to ISO 14644

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