Its outstanding performance has made this fused silica to an indispensable material in manufacturing of leading edge semiconductors and optical applications and it thus perfectly adds to Wafer Universe‘ portfolio of materials for stock products.
100 mm WAFERS
- material: high purity fused silica
- diameter: 100.0 ± 0.3 mm
- cte: 0.57 ppm/K
- thickness tolerance: ± 10 μm
- edge exclusion: 6 mm
- polishing: double side polished
- bow: < 30 µm
- flat: SEMI (32.5 mm)
- surface roughness (Ra): < 0.5 nm
- ttv: < 10 μm
- scratch-dig: 20-10
- cte: 0.57 ppm/K
- packaging: cleanroom packed
- packing units: 10 pcs, 25 pcs
- material data sheet
150 mm WAFERS
- material: high purity fused silica
- diameter: 150.0 ± 0.3 mm
- cte: 0.57 ppm/K
- thickness tolerance: ± 10 μm
- edge exclusion: 6 mm
- polishing: double side polished
- bow: < 60 µm
- flat: SEMI (57.5 mm)
- surface roughness (Ra): < 0.5 nm
- ttv: < 10 μm
- scratch-dig: 20-10
- cte: 0.57 ppm/K
- packaging: cleanroom packed
- packing units: 10 pcs, 25 pcs
- material data sheet
200 mm WAFERS
- material: high purity fused silica
- diameter: 200.0 ± 0.3 mm
- cte: 0.57 ppm/K
- thickness tolerance: ± 10 μm
- edge exclusion: 6 mm
- polishing: double side polished
- bow: < 80 µm
- notch: SEMI
- surface roughness (Ra): < 0.5 nm
- ttv: < 10 μm
- scratch-dig: 20-10
- cte: 0.57 ppm/K
- packaging: cleanroom packed
- packing units: 10 pcs, 25 pcs
- material data sheet
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