Plan Optik AG, the leading manufacturer of glass wafers, expands its production of blank Borofloat® 33 substrate wafers immensely. In response to the high demand of stock wafers, Plan Optik has enlarged its capacity in sizes from 100 up to 300 mm diameter and in various thicknesses and roughnese. From now on Plan Optik can deliver almost every customer with standard glass wafers in respond to it’s needs – simple and fast.
Standard wafers are available either with standard polishing finish – or with high-quality MDF polishing finish. Standard polished wafers can be used for all applications such as anodic bonding with Si. The roughness could be reduced to lower than 1 nm. In addition, MDF polished wafers are specially developed for wet-chemical structuring and direct bonding with a roughness lower than 0.5 nm.
Plan Optik’s new standard wafers offer TTV less than 10 µm and are all cleanroom packed under ISO 6 conditions according to ISO 14644.
Borofloat® 33 wafers from Plan Optik are mainly used as packaging wafers for wafer-level-packaging (WLP) by anodic bonding but also as substrates for various MEMS and optical applications.
Besides above standardized wafers customized wafers are available on request. The diameter ranges between 100 and 300 mm with low thickness tolerances, high surface quality and low TTV values.
In order to guarantee the highest quality, Plan Optik employs quality management systems is certified as per ISO TS 16949, ISO 14001 and ISO 9001.
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