Silicon On Glass (SOG) wafers consist of silicon that is permanently bonded to glass with adapted cte to match the coefficient of thermal expansion of silicon. Due to Wafer Universe‘ manufacturing capabilities any combination of thickness can be manufactured in diameters up to 200 mm. Silicon-on-Glass wafers feature two options that are available off the shelf in both 150mm and 200mm. Either thin silicon is bonded to comparably thick glass wafer that serves as the base respectively a thin glass wafer is bonded to silicon.

These wafers can be used in IC manufacturing. Furthermore, these SOG wafers can replace standard SOI wafers with lower parasitic capacitance. Using this combination of silicon and glass as insulator can be used to create new technologies and products in semiconductor and MEMS industry.

General properties

  • materials: cte matched materials
  • packing units: 10 pcs, 25 pcs
  • scratch dig: 60-40
  • edge exclusion: 6 mm
  • polishing: double side polished
  • glass: BOROFLOAT33®
  • Si type/dopant: p/bor
  • Si crystall orientation: (100)
  • Si resistivity: 1-100 Ohm cm
  • packaging: cleanroom packed
  • bonding interface defects (max.):

1 defect up to 2 mm

10 defects up to 500 µm

< 50 µm will be ignored

150 mm WAFERS

  • diameter: 150.0 ± 0.3 mm
  • SEMI flat /notch: 57.5 mm
Si* (μm) Glass* (μm) article number
50 ± 5 500 ± 10 SOG-150×0550-SOG-00
500 ± 10 50 ± 5 SOG-150×0550-GOS-00

200 mm WAFERS

  • diameter: 200.0 ± 0.3 mm
  • SEMI flat /notch: Notch
Si* (μm) Glass* (μm) article number
50 ± 5 500 ± 10 SOG-200×0550-SOG-00
500 ± 10 50 ± 5 SOG-200×0550-GOS-00

*thickness

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