UHP (ultra high purity) fused silica wafers are the material of choice when it comes to high demands for transmission in UV range and chemical purity. The material features extremely low trace metal and OH content, enabling the use in high thermal processing. In addition the UHP fused silica has a low coefficient of thermal expansion (cte) making it suitable for optical applications in alternating temperatures.

Its outstanding performance has made this fused silica to an indispensable material in manufacturing of leading edge semiconductors and optical applications and it thus perfectly adds to Wafer Universe‘ portfolio of materials for stock products.

General properties

  • material: UHP fused silica

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  • cte: 0.59 ppm/K
  • thickness tolerance: ± 10 μm
  • edge exclusion: 6 mm
  • polishing: double side polished
  • surface roughness (Ra): < 0.5 nm
  • ttv: < 10 μm
  • scratch-dig: 20-10
  • surface roughness: <0.5 nm (Ra)
  • packaging: cleanroom packed
  • packing units: 10 pcs, 25 pcs
  • material data sheet

100 mm WAFERS

  • diameter: 100.0 ± 0.3 mm
  • SEMI flat /notch: 32.22 mm
thickness (μm) article number
525 DSP-100×0525-FSQ-00
1000 DSP-100×1000-FSQ-00

150 mm WAFERS

  • diameter: 150.0 ± 0.3 mm
  • bow: < 60 μm
  • SEMI flat /notch: 57.5 mm
thickness (μm) article number
525 DSP-150×0525-FSQ-00
675 DSP-150×0675-FSQ-00
1000 DSP-150×1000-FSQ-00

200 mm WAFERS

  • diameter: 200.0 ± 0.3 mm
  • bow: < 80 μm
  • SEMI flat /notch: Notch
thickness (μm) article number
525 DSP-200×0525-FSQ-00
1000 DSP-200×1000-FSQ-00

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